The heat dissipation method of an electronic radiator, the basic purpose of installing an electronic radiator is to transfer the heat generated in the power semiconductor device. The method of transferring heat from one medium to another can be one or more of the following three methods.

　　 These three methods are: (1) Heat conduction Heat conduction refers to the transfer of heat from a high temperature area to a low temperature area through objects in direct contact. It is the most effective way to dissipate heat from junction to case and case to heat sink of power semiconductor devices. (2) Thermal convection The density of hot air around the heating object is lower than that of the cold air nearby. Therefore, convection will naturally form between hot air and cold air. The method of using flowing gas or liquid to take away the heat through the surface of the heat conductor is called thermal convection. (3) Thermal radiation Due to the temperature difference between the heat conductor and adjacent objects or spaces, the heat conductor emits heat outward in the form of radiation. This method of heat dissipation is called thermal radiation. According to the principle of black body radiation, the higher the surface temperature of the radiator, the rougher the surface and the higher the surface blackening rate, the stronger the radiator's ability to radiate heat. Therefore, most radiators are oxidized and blackened to increase their radiant heat dissipation capabilities. The heat dissipation of the heat sink of the power semiconductor device to the surrounding environment is mainly by convection heat dissipation and radiation heat dissipation, but conduction heat dissipation also plays a role. Radiator materials Copper and aluminum are the most commonly used materials for radiators. Although copper has stronger thermal conductivity than aluminum, it is more expensive than aluminum. Therefore, the ideal material for making heat sinks is aluminum.